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Manufacturing Processes
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Circuit Printing
De Amertek has solved conflicting demands of large and small volume circuit printing within the same project
by using numerous sets of automatic and semi-automatic printers.
This way, pressure, speed and screen tension can be adjusted to match particular circuit requirements,
and the cost advantages of high speed printing are never derailed by low volume specialty print production.
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Surface Mount
De Amertek achieves a high level of accuracy in the placement of fine pitch and small package components
through the use of the latest technology in automated assembly machines. This accuracy is enhanced by the
electronic visual alignment systems of our placement and solder paste printing machines.
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Through Hole
De Amertek has an extensive array of assembly techniques for leaded components, from light-guided hand
assembly to automated axial and radial insertion.
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Components
With De Amertek’s wave solder and reflow equipment, discrete components ranging from conventional axial
leaded parts to Cer-DIP forms to flat packs and SOT parts can be handled.
We bond silicon chip devices on a thick film conductor with eutectic or epoxy bonding, then gold wire or
aluminum wire bonding can be handled. Ball bonders for gold wire and ultrasonic bonding for aluminum wire
can bond wires with diameters from 1 to 15 mils. Ribbon bonding is also available for power devices and jumpers.
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Firing
De Amertek’s multiple furnaces – with peak temperatures of 950° C, controllable at +/- 1° C – can be set
to the ideal temperature profile for assuring consistent quality from the metallization process.
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Laser Trimming
Computer-controlled laser trimmers precisely trim resistors to the desired performance values.
Step and repeat handlers are used for multi-circuits or passive trims. Multi-position trimmers are
used where the extreme precision of high quality active trims are required. Active trimming is for
gain, voltage, current, frequency, and pulse width adjustments.
That’s how De Amertek can maximize trimming speed while maintaining ultra high levels of precision.
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