At De Amertek, we've built our reputation on our ability to deliver premier quality products quickly and with low development and mass production costs. Here are some examples of our technical capabilities.

Thick Film Hybrids
We have accumulated over 25 years of experience in thick film hybrid design and manufacturing. We have successfully developed fine-line circuitry using photolithography, copper conductor process, and MCMs, and we provide our customers with professional packaging services. The quality and technology of our thick film hybrids are at the forefront worldwide.

Custom Resistor Cards
De Amertek has a history of experience in manufacturing custom designed resistor networks. We are capable of meeting unique customer requirements, such as different resistance values, tighter tolerance and ratio matching. We also specialize in resistor-capacitor networks and capacitor array, as well as diode array manufacturing.

PCB Assembling
De Amertek has the capability of carrying out a full line of PCB assembling, including SMD, stuffing, wire harness soldering, heat sink attaching, plastic assembling, and RF shielding.

Module Assembling
De Amertek also has the capacity to combine sub-modules into a fully functional module. Our capability of designed and fabricated thermal dissipation devices for thermal management concerns has been utilized in many industries. Black box and gray box approaches are our specialties.

Injection and Transfer Modling
We have transfer molding capability for specially designed products. Our injection molding facility is designed especially for circuit molding, at various hardnesses of molding materials.

Packaging
Pin arrangements are available in a variety of forms, with single-in-line and double-in-line being preferred for most applications. Circuits are then provided the protective isolation of potting, hermetical sealing, or conformal coating. Our complete assembly operation is capable of providing whichever method the client specifies.