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Manufacturing Technology
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Solder Printers
Printing speed: 5-100mm/sec
Alignment: camera auto
Printing accuracy: +/-0.04mm
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High Speed Chip Shooters
Applicable PCB size: 50*50-330*250mm
Applicable PCB thickness: 0.5-2.5mm
PCB transition time: 4.0 sec
Placement speed: 0.4 sec/point
Placement accuracy: +/-0.1mm
Applicable components: 1.0*0.5mm-20*20mm thickness, max. 6.5mm
Feeders: max. 80 feeders (8mm tape) 8, 12, 16, 24, 32mm
Placement head: 16
Nozzles: 5pcs/head (for 1005-SOIC)
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Reflow
Conveying system: center support
Heating and cooling system:
-First zone: IR
-Forced convection system: 9 zone/18 heater, 2 cooling zone
Temperature accuracy: +/-0.1 degree
Min oxide: 10-25ppm
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Flip Chip Bonding
Application: MCM, FC, uBGA, CSP
Component size: 0.5x0.5mm-35x35mm
Placement accuracy: ± 0.012 mm
Min. bump dia./pitch: 50/100 µm
8-10 sec/flip chip bonding
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Inspection Systems
X-ray: 2 um resolution, 30-160 kV, 0-200 um A , 1800 X magnification, 5 axis manipulation
C-SAM: A.B.C. scope image, S-image, measure scale, frequency band 1-100 MHz, through transmission
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